Global AI Industry Chain

Global AI Market Map

Global AI infrastructure and application chain across US, Japan, Korea, Taiwan, and Europe. English is the primary research label; Chinese terms are used as a secondary recognition layer for institutional cross-border coverage.

14
Nodes
5
Links
14
Priced
0
Gaps
AI Capex Supercycle (AI资本开支周期)HBM Shortage (高带宽存储短缺)China Domestic Substitution (国产替代)Datacenter Power Bottleneck (数据中心电力瓶颈)Inference Demand Explosion (推理需求爆发)GPU (图形处理器)ASIC (专用集成电路)HBM (高带宽存储)CPO (共封装光学)
Connected Supply Chain Lanes

Layered AI Industry Flow

Lanes are grouped by category; explicit direction appears only in relationships below.
Layer 1

AI Chips & Accelerators (AI芯片与加速器)

2 nodes · 2 priced

Layer 2

HBM / Memory (高带宽存储 / 存储器)

2 nodes · 2 priced

Layer 3

Foundry (晶圆代工)

1 nodes · 1 priced

Layer 4

Semiconductor Equipment (半导体设备)

2 nodes · 2 priced

Layer 5

Networking / Optical / CPO (网络 / 光互联 / 共封装光学)

3 nodes · 3 priced

Layer 6

Datacenter Power / Cooling / Colocation (数据中心电力 / 散热 / 托管)

2 nodes · 2 priced

Layer 7

AI Software / SaaS (AI软件 / SaaS)

1 nodes · 1 priced

Layer 8

Robotics / Automation (机器人 / 自动化)

1 nodes · 1 priced

Directional Relationship Lines

Dependency / Supplier / Beneficiary Map

5 links
NVIDIA -> TSMC (台积电)
dependency · 5/5
directional line

NVIDIA advanced accelerators depend on TSMC leading-edge manufacturing.

AMD -> TSMC (台积电)
dependency · 5/5
directional line

AMD accelerators depend on TSMC advanced-node supply.

NVIDIA -> SK Hynix (SK海力士)
dependency · 4/5
directional line

NVIDIA accelerator supply is tied to HBM availability.

Arista Networks -> NVIDIA
beneficiary · 4/5
directional line

AI accelerator clusters increase high-speed networking demand.

Vertiv -> NVIDIA
second_order_beneficiary · 4/5
directional line

Higher-density AI racks increase power and cooling demand.